On October 28, Yongsi Electronics (Ningbo) Co., Ltd. (hereinafter referred to as “Ningbo Electronics”, stock code “688362”) issued a letter of intent for the initial offering. The company will publicly issue 60 million shares this time, and the initial inquiry date will be issued. It is November 2, 2022, and the subscription date is November 7, 2022. Yongsi Electronics plans to raise 1.5 billion yuan in this IPO, which is mainly used for high-density SiP RF module packaging and testing projects and integrated circuit advanced packaging wafer bump industrialization projects.
Yongsi Electronics is mainly engaged in the packaging and testing business of integrated circuits. Its downstream customers are mainly integrated circuit design companies. The products are mainly used in RF front-end chips, AP SoC chips, touch chips, WiFi chips, Bluetooth chips, MCU and other IoT chips. , power management chips, computing chips, etc.
Since its establishment, the company has focused on the advanced packaging field in the IC packaging and testing business. The cleanliness level of the workshop, production equipment, production line layout, process route, technology research and development, business team, and customer introduction are all guided by the advanced packaging business. The business starting point higher. Therefore, compared with competitors in the same industry, the product structure of Yongsi Electronics is relatively complete and optimized, and its sales revenue mainly comes from mid-to-high-end packaging products. WiFi chip packaging and testing, Bluetooth chip packaging and testing, MCU and other Internet of Things (IoT) chip packaging and testing and other emerging application fields have a good market reputation and brand awareness.
At the same time, Yongsi Electronics has strong technical research and development capabilities, has a complete and efficient research and development team, and attaches great importance to the training and construction of the research and development team. The core members of the research and development team have rich experience in technology development in the integrated circuit packaging and testing industry. As of June 30, 2022, the company has obtained a total of 186 patents, including 88 invention patents, 96 utility model patents, and 2 appearance patents. The company has core products in the fields of high-density fine-pitch bump flip-chip products (FC products), system-in-package products, 4G/5G RF power amplifier packaging technology, high-density large-size frame packaging products, MEMS packaging products, and IC testing. technology.
With the above advantages, Yongsi Electronics has been widely recognized by integrated circuit design companies, and has established good cooperative relations with many well-known design companies at home and abroad. Corporate customers include: Crystal Morning, Aojie Technology, Weijie Chuangxin, Fullhan Micro, Hengxuan Technology, Canaan, Feixiang, Ruishi Chuangxin, MediaTek, Xingchen Technology, Huiding Technology, ZTE Micro, Weiwei Well-known chip companies in the industry such as Ernst, Beijing Junzheng, and Onray Micro. Yongsi Electronics said that the company will always adhere to the corporate core values of “commitment to integrity, fairness and openness, and focus on cooperation”, market-oriented, technology-supported, honesty and trustworthiness as the fundamental principle, and continuously improve technical strength to provide customers with the most Optimized semiconductor packaging and testing technology solutions. In order to achieve the company’s strategic goals, the company will further improve the governance structure, continuously expand the company’s production and sales scale, and enhance the company’s profitability in the next three years with the support of the brand sales strategy, technological innovation strategy and talent strategy.